Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7999380 | Process for manufacturing substrate with bumps and substrate structure | — | 2011-08-16 |
| 7968992 | Multi-chip package structure and method of fabricating the same | — | 2011-06-28 |
| 7923299 | Manufacturing process for embedded semiconductor device | — | 2011-04-12 |
| 7849594 | Manufacturing method for integrating passive component within substrate | — | 2010-12-14 |
| 7825500 | Manufacturing process and structure for embedded semiconductor device | — | 2010-11-02 |
| 7754980 | Substrate with multilayer plated through hole and method for forming the multilayer plated through hole | — | 2010-07-13 |
| 7748111 | Manufacturing process of a carrier | Kuo-Hsiang Lin, Yao-Ting Huang | 2010-07-06 |
| 7728234 | Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same | — | 2010-06-01 |
| 7591067 | Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same | — | 2009-09-22 |
| 7550320 | Method of fabricating substrate with embedded component therein | — | 2009-06-23 |
| 7436680 | Multi-chip build-up package of optoelectronic chip | — | 2008-10-14 |