Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11837572 | Apparatus and method for manufacturing semiconductor package structure | Chun-Min Wu | 2023-12-05 | $1,264,000 |
| D992751 | Sample processing instrument | Xi Liu, Jingzhang WU | 2023-07-18 | |
| 11687306 | Displaying control method | I-Jen Wen | 2023-06-27 |