Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198740 | Semiconductor package structure and encapsulating module for molding the same | Chen-Tsung Chang, Chih-Yuan Lin | 2012-06-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198740 | Semiconductor package structure and encapsulating module for molding the same | Chen-Tsung Chang, Chih-Yuan Lin | 2012-06-12 |