Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7855424 | Method for packaging semiconductor device and package structure thereof | — | 2010-12-21 |
| 7829981 | Semiconductor device packages with electromagnetic interference shielding | — | 2010-11-09 |
| 7541218 | Wafer-level chip package process | — | 2009-06-02 |
| 7294559 | Wafer dicing process for optical electronic packing | — | 2007-11-13 |
| 7154053 | Optoelectronic package with wire-protection lid | — | 2006-12-26 |