Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8907371 | Light emitting diode package and light emitting device having the same | Chih-Hsun Ke, CHAO-HSIUNG CHANG | 2014-12-09 |
| 8802467 | Method of manufacturing encapsulation structure for encapsulating LED chip | Chih-Hsun Ke | 2014-08-12 |
| 8716744 | LED package, method for making the LED package and light source having the same | Chih-Hsun Ke, CHAO-HSIUNG CHANG | 2014-05-06 |
| 8674394 | Light emitting device package and method of manufacturing the same | Chih-Hsun Ke | 2014-03-18 |
| 8624389 | Light emitting diode module | Chih-Hsun Ke | 2014-01-07 |
| 8592857 | LED package | Chih-Hsun Ke | 2013-11-26 |
| 8587012 | LED package and mold of manufacturing the same | Chih-Hsun Ke | 2013-11-19 |
| 8564003 | LED package | Chih-Hsun Ke, Ming-Ta Tsai, CHAO-HSIUNG CHANG | 2013-10-22 |
| 8546158 | Method for distributing phosphor particulates on LED chip | Chih-Hsun Ke | 2013-10-01 |
| 8513698 | LED package | Chih-Hsun Ke | 2013-08-20 |
| 8507932 | LED unit | Chih-Hsun Ke, HSING-FEN LO | 2013-08-13 |
| 8455901 | LED unit having self-connecting leads | Chih-Hsun Ke | 2013-06-04 |
| 8449153 | LED module | HSING-FEN LO, Chih-Hsun Ke | 2013-05-28 |
| 8409885 | Method for packaging light emitting diode | Chih-Hsun Ke | 2013-04-02 |
| 8318514 | LED package, and mold and method of manufacturing the same | Chih-Hsun Ke | 2012-11-27 |
| 8268652 | Method for distributing fluorescence onto LED chip | Chih-Hsun Ke | 2012-09-18 |
| D645830 | Housing for light emitting diode | HSING-FEN LO, Chih-Hsun Ke | 2011-09-27 |
| D645422 | Housing for light emitting diode | HSING-FEN LO, Chih-Hsun Ke | 2011-09-20 |
| D645423 | Housing for light emitting diode | HSING-FEN LO, Chih-Hsun Ke | 2011-09-20 |