Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8551794 | LED package and mold of manufacturing the same | CHAO-HSIUNG CHANG, Wen-Liang Tseng | 2013-10-08 |
| 8492790 | LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the same | — | 2013-07-23 |
| 8436392 | Light emitting diode package and manufacturing method thereof | CHAO-HSIUNG CHANG, Chieh Chang | 2013-05-07 |
| 8378378 | Light emitting diode package and method of fabricating the same | CHAO-HSIUNG CHANG, Wen-Liang Tseng | 2013-02-19 |
| 8298861 | Package structure of compound semiconductor device and fabricating method thereof | PIN-CHUAN CHEN | 2012-10-30 |
| 8143080 | Method for manufacturing LED package and substrate thereof | — | 2012-03-27 |
| 7893528 | Package structure of compound semiconductor device and fabricating method thereof | PIN-CHUAN CHEN | 2011-02-22 |
| 7863717 | Package structure of integrated circuit device and manufacturing method thereof | SHIH HSIUNG CHAN, PIN-CHUAN CHEN | 2011-01-04 |