LY

Lee-Sheng Yen

AM Advanced Materials: 8 patents #1 of 29Top 4%
Overall (All Time): #647,564 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
9084341 Fabrication method of packaging substrate Doau-Tzu Wang 2015-07-14
8987060 Method for making circuit board 2015-03-24
8836108 Circuit board structure and package structure 2014-09-16
8748234 Method for making circuit board 2014-06-10
8742567 Circuit board structure and packaging structure comprising the circuit board structure 2014-06-03
8698008 Packaging substrate and fabrication method thereof Doau-Tzu Wang 2014-04-15
8628636 Method of manufacturing a package substrate Doau-Tzu Wang 2014-01-14
8102063 Pad structure with a nano-structured coating film 2012-01-24