Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7347968 | Method to form multi-material components | Kay-Leong Lim, Eng-Seng Tan, Robin Baumgartner | 2008-03-25 |
| 6935022 | Advanced microelectronic heat dissipation package and method for its manufacture | Randall M. German, John C. Johnson | 2005-08-30 |
| 6776955 | Net shaped articles having complex internal undercut features | Kay-Leong Lim, Eng-Seng Tan | 2004-08-17 |
| 6761852 | Forming complex-shaped aluminum components | Chee-Tian Yeo | 2004-07-13 |
| 6660225 | Method to form multi-material components | Kay-Leong Lim, Eng-Seng Tan, Robin Baumgartner | 2003-12-09 |
| 6569380 | Enclosure for a semiconductor device | Kay-Leong Lim, Eng-Seng Tan | 2003-05-27 |
| 6461563 | Method to form multi-material components | Kay-Leong Lim, Eng-Seng Tan, Robin Baumgartner | 2002-10-08 |
| 6045601 | Non-magnetic, high density alloy | — | 2000-04-04 |