Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9082821 | Method for forming copper interconnection structures | Junichi Koike | 2015-07-14 |
| 8580688 | Copper interconnection structure and method for forming copper interconnections | Junichi Koike | 2013-11-12 |
| 8531033 | Contact plug structure, semiconductor device, and method for forming contact plug | Junichi Koike, Kouji Neishi | 2013-09-10 |
| 8420535 | Copper interconnection, method for forming copper interconnection structure, and semiconductor device | Junichi Koike | 2013-04-16 |
| 8324730 | Copper interconnection structure and method for forming copper interconnections | Junichi Koike | 2012-12-04 |
| 8258626 | Copper interconnection, method for forming copper interconnection structure, and semiconductor device | Junichi Koike | 2012-09-04 |
| 8169079 | Copper interconnection structures and semiconductor devices | Junichi Koike | 2012-05-01 |
| 8163649 | Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure | Junichi Koike | 2012-04-24 |
| 8112885 | Method for forming copper interconnection structures | Junichi Koike | 2012-02-14 |
| 7755192 | Copper interconnection structure, barrier layer including carbon and hydrogen | Junichi Koike | 2010-07-13 |
| 4889831 | Method of forming a high temperature stable ohmic contact to a III-V substrate | Kazuaki Ishii, Toshiro Futatsugi, Toshio Oshima, Toshio Fujii, Naoki Yokoyama | 1989-12-26 |