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2021-06-15 |
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Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chip |
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2019-08-13 |
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Semiconductor device having plated outer leads exposed from encapsulating resin |
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2018-10-23 |
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Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame |
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2018-08-07 |
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Semiconductor device having semiconductor chip mounted on lead frame |
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2017-07-04 |
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Semiconductor device and method of manufacturing the same |
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2015-09-15 |
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Energy management system and energy management method |
Yutaka Iino, Dai Murayama |
2013-12-17 |
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System for managing energy at loads |
Yutaka Iino |
2013-09-24 |
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Supply-and-demand control system of distributed and coordinated type, for use in power systems |
Yutaka Iino |
2012-03-20 |
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Hiroyuki Takahashi, Shugo Takahashi, Toshiharu Izuno |
2009-09-01 |
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2001-03-27 |
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Kazuhiko Takata |
1991-10-01 |
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Hiroichi Yoshida |
1990-09-25 |
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Akira Hirami |
1990-06-05 |
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1990-02-20 |
