Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043434 | Method of manufacturing a semiconductor device | Hitomi Sakurai | 2021-06-22 |
| 10978414 | Semiconductor device and method of manufacturing a semiconductor device | Shinjiro Kato | 2021-04-13 |
| 10607954 | Semiconductor device and method of manufacturing a semiconductor device | Shinjiro Kato | 2020-03-31 |
| 10580708 | Method of manufacturing a semiconductor device and semiconductor device | Hitomi Sakurai | 2020-03-03 |
| 10388618 | Semiconductor device and method of manufacturing a semiconductor device | Takeshi Morita, Shinjiro Kato, Yukihiro Imura | 2019-08-20 |
| 10297562 | Semiconductor device and method of manufacturing a semiconductor device | Kaku IGARASHI, Shinjiro Kato, Hisashi Hasegawa, Yukihiro Imura | 2019-05-21 |
| 10249584 | Semiconductor device and method of manufacturing a semiconductor device | Takeshi Morita, Shinjiro Kato, Yukihiro Imura | 2019-04-02 |
| 9945912 | Hall sensor and compensation method for offset caused by temperature distribution in hall sensor | Takaaki Hioka | 2018-04-17 |
| 9917055 | Semiconductor device having fuse element | Yukihiro Imura, Yoshitaka Kimura | 2018-03-13 |
| 9818691 | Semiconductor device having a fuse element | Yukihiro Imura, Yoshitaka Kimura | 2017-11-14 |
| 9694523 | Semiconductor manufacturing apparatus | Yasuo Terui | 2017-07-04 |
| 9679835 | Method of manufacturing resin-encapsulated semiconductor device, and lead frame | Shinya Kubota | 2017-06-13 |
| 9437669 | Semiconductor device | Hirofumi Harada | 2016-09-06 |
| 9362195 | Semiconductor device | Koji Tsukagoshi, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi | 2016-06-07 |
| 9296142 | Semiconductor manufacturing apparatus | Yasuo Terui | 2016-03-29 |
| 9184116 | Method of manufacturing resin-encapsulated semiconductor device, and lead frame | Shinya Kubota | 2015-11-10 |
| 9117799 | Method of manufacturing semiconductor device having pad region for wire-bonding | — | 2015-08-25 |
| 8704385 | Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device | — | 2014-04-22 |
| 8324708 | Semiconductor integrated circuit device and manufacturing method thereof | Yukimasa Minami | 2012-12-04 |