Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11518914 | Pressure sensitive adhesive assembly comprising filler material | Jan Heimink, Jan D. Forster, Jan U. Wieneke, Frank Kuester, Siegfried R. Goeb +4 more | 2022-12-06 |
| 11332648 | Pressure sensitive adhesive assembly comprising thermoplastic filler material | Jan Heimink, Jan D. Forster | 2022-05-17 |
| 11267220 | Multilayer pressure-sensitive adhesive assembly | Doreen Eckhardt, Regina Sikora, Jan U. Wieneke, Jan D. Forster, Frank Kuester | 2022-03-08 |
| 11130889 | Post-curable pressure-sensitive adhesive | Mareike Richter, Silke D. Mechernich, Siegfried R. Goeb, Peter Bissinger | 2021-09-28 |
| 10633495 | Pressure sensitive adhesive assembly suitable for bonding to uneven substrates | Jan Heimink, Andreas Backes, Adrian T. Jung, Dirk Hasenberg | 2020-04-28 |
| 10501591 | Pressure sensitive adhesive assembly suitable for bonding to uneven substrates | Jan Heimink, Andreas Backes, Adrian T. Jung, Dirk Hasenberg | 2019-12-10 |
| 9845414 | Multilayer pressure sensitive adhesive assembly | Jan U. Wieneke, Frank Kuester, Zhong Chen, Jingjing Ma, Doreen Eckhardt +4 more | 2017-12-19 |