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Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding |
Peter B. Hogerton, Kevin Chen, Robert L. D. Zenner |
2007-01-30 |
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Circuit elements using z-axis interconnect |
Yu-Hsun Chen, Brian E. Schreiber, Joshua W. Smith |
2004-09-14 |
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Methods for making z-axis electrical connections |
Yu-Hsun Chen, Peter B. Hogerton |
2001-07-17 |
| 6246010 |
High density electronic package |
Robert L. D. Zenner, Kevin Chen |
2001-06-12 |
| 6063647 |
Method for making circuit elements for a z-axis interconnect |
Yu-Hsun Chen, Brian E. Schreiber, Joshua W. Smith |
2000-05-16 |
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Method of making a Z axis interconnect circuit |
Yu-Hsun Chen, Joshua W. Smith |
1999-02-23 |
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Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
Martin B. Wolk, Thomas A. Isberg, Michael A. Kropp, William V. Dower |
1997-11-11 |
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Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
Peter A. Gits |
1997-02-11 |
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Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
Peter A. Gits |
1995-03-28 |
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Slanted pole head for magnetic recording |
Jerry A. Sievers |
1987-10-13 |