JG

Joel A. Gerber

3M: 10 patents #1,587 of 11,543Top 15%
Overall (All Time): #521,834 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7170185 Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding Peter B. Hogerton, Kevin Chen, Robert L. D. Zenner 2007-01-30
6791036 Circuit elements using z-axis interconnect Yu-Hsun Chen, Brian E. Schreiber, Joshua W. Smith 2004-09-14
6260264 Methods for making z-axis electrical connections Yu-Hsun Chen, Peter B. Hogerton 2001-07-17
6246010 High density electronic package Robert L. D. Zenner, Kevin Chen 2001-06-12
6063647 Method for making circuit elements for a z-axis interconnect Yu-Hsun Chen, Brian E. Schreiber, Joshua W. Smith 2000-05-16
5873161 Method of making a Z axis interconnect circuit Yu-Hsun Chen, Joshua W. Smith 1999-02-23
5685939 Process for making a Z-axis adhesive and establishing electrical interconnection therewith Martin B. Wolk, Thomas A. Isberg, Michael A. Kropp, William V. Dower 1997-11-11
5601678 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board Peter A. Gits 1997-02-11
5401913 Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board Peter A. Gits 1995-03-28
4700253 Slanted pole head for magnetic recording Jerry A. Sievers 1987-10-13