Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2017-09-26 | $35,188,000 |
| 9333723 | Adhesive composition | Yorinobu Takamatsu, Yoshiteru Kakinuma | 2016-05-10 | $31,902,000 |
| 9230873 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2016-01-05 | $17,182,000 |