AL

Andrew C. Lottes

3M: 11 patents #1,441 of 11,543Top 15%
Overall (All Time): #450,070 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11262387 Test point voltage sensor for high voltage separable connectors David V. Mahoney, Carl J. Wentzel, Shuguang Wu, Laszlo Markos, James S. McHattie +4 more 2022-03-01
10720767 Multilayer stress control article and dry termination for medium and high voltage cable applications Robert J. Schubert, Christopher J. Evoniuk, Jens Weichold 2020-07-21
10121570 Dielectric material with enhanced breakdown strength Nanayakkara L. D. Somasiri, Paul V. Huynh, William L. Taylor, Levent Biyikli, Carl E. Fisher 2018-11-06
9390833 Method of making an electrical stress control device having a dielectric material with non-linear dielectric constant Nanayakkara L. D. Somasiri, Jimmie R. Baran, Jr., Paul V. Huynh 2016-07-12
9349498 Dielectric material with non-linear dielectric constant Nanayakkara L. D. Somasiri, Jimmie R. Baran, Jr., Badri Veeraraghavan, Paul V. Huynh, Dipankar Ghosh 2016-05-24
8974706 Dielectric material with non-linear dielectric constant Nanayakkara L. D. Somasiri, Jimmie R. Baran, Jr., Ge Jiang, Badri Veeraraghavan, Paul V. Huynh +1 more 2015-03-10
7888604 Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method Kohichiro Kawate, James G. Vana, Jr., Barbara L. Birrell, Alexander W. Barr 2011-02-15
7052772 Material for packaging electronic components Mark A. Roehrig 2006-05-30
6391954 High clarity image bearing sheet Jamshid Azizi, Joseph C. Carls, Shigeaki Dohgoshi, Koji Kamiyama 2002-05-21
6296931 High clarity image bearing sheet Jamshid Azizi, Joseph C. Carls, Shigeaki Dohgoshi, Koji Kamiyama 2001-10-02
5914157 Solventless hot melt process for the preparation of pressure sensitive adhesives Daniel C. Munson, Angelo Psellas, Denis Brisson 1999-06-22