AY

Akira Yamauchi

BC Bondtech Co.: 5 patents #1 of 2Top 50%
UN Unknown: 3 patents #37 of 2,491Top 2%
KT Kabushiki Kaisha Toshiba: 2 patents #129 of 861Top 15%
TS Toshiba Electronic Devices & Storage: 2 patents #35 of 255Top 15%
NE Nec: 1 patents #472 of 917Top 55%
AG Agc: 1 patents #78 of 231Top 35%
NI Nec Solution Innovators: 1 patents #3 of 15Top 20%
📍 Kyoto, MI: #1 of 11 inventorsTop 10%
Overall (2025): #8,159 of 469,880Top 2%
9
Patents 2025

Issued Patents 2025

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12409644 Substrate bonding method and substrate bonding system Tadatomo Suga 2025-09-09
12388045 Bonding system and bonding method Tadatomo Suga 2025-08-12
12381526 Amplifier circuit and sensor circuit Hiroshi Yoshino 2025-08-05
12341036 Resin shaping device 2025-06-24
12283370 Facility presentation apparatus, facility presentation method and recording medium Masahiro Hayashitani, Masahiro Kubo, Akihiko SHIBANO, Takayuki Banno, Junichi YAHARA +2 more 2025-04-22
12267052 Power amplifying device 2025-04-01
12261070 Component mounting system and component mounting method 2025-03-25
12261147 Bonding system and bonding method Tadatomo Suga 2025-03-25
12187010 Glass structure, adhesive structure, and method for producing glass structure Masayuki SASE 2025-01-07