Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322445 | Three dimensional semiconductor memory structure | Kaiwei CAO, Peng SUN, Jun Zhou, Wei-Hang Huang, Chunyuan Hou | 2025-06-03 |
| 12322707 | Large die wafer, large die and method of forming the same | Sheng HU, Jun Zhou, Peng SUN, Senhua Shi, Hu Yang | 2025-06-03 |