Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12252613 | Packaging film and preparation method thereof, and filter chip packaging method | De Wu, Ting Li, Shuhang Liao | 2025-03-18 |
| 12255175 | Wafer warpage regulation epoxy functional film, and preparation method and application thereof | De Wu, Qiao Zhou, Shuhang Liao | 2025-03-18 |
| 12209171 | Liquid epoxy molding compound and preparation method thereof | De Wu, Shengquan Wang, Shuhang Liao | 2025-01-28 |