Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293984 | Method for packaging stacking flip chip | Honglei Ran, Kui Zhang, Shanbin Xi, Huaguang Liu, Hailong ZHAO | 2025-05-06 |
| 12284876 | Array substrate and display panel | Huihui Zhao | 2025-04-22 |