JW

Jin-Neng Wu

UM United Microelectronics: 1 patents #212 of 515Top 45%
📍 Tainan, TW: #286 of 764 inventorsTop 40%
Overall (2025): #342,232 of 469,880Top 75%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12215018 Method for manufacturing package structure — 2025-02-04