Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408296 | Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same | Feng Zhou, Yanghe Liu | 2025-09-02 |
| 12387994 | Power device embedded printed circuit board assemblies with thin film dielectric layers | Feng Zhou, Yanghe Liu | 2025-08-12 |
| 12317427 | UV curable dielectric materials for 3D printing and 3D printing systems with the same | Feng Zhou, Ercan Mehmet Dede | 2025-05-27 |
| 12249554 | Power electronic device assemblies having an electrically insulating S-cell | Feng Zhou | 2025-03-11 |
| 12238906 | Power electronic device assemblies having heat spreaders and electrically insulating layer | Feng Zhou | 2025-02-25 |