Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432852 | Circuit board structure with embedded ceramic substrate and manufacturing process thereof | Yu-Hsien LIAO, JHIH-WEI LAI, JIAN-YU SHIH, MING-YEN PAN | 2025-09-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432852 | Circuit board structure with embedded ceramic substrate and manufacturing process thereof | Yu-Hsien LIAO, JHIH-WEI LAI, JIAN-YU SHIH, MING-YEN PAN | 2025-09-30 |