Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417925 | Method of conductive material deposition | Hirokazu Aizawa, Kai-Hung Yu, Nicholas Joy, Yusuke Yoshida | 2025-09-16 |
| 12336274 | Self-aligned method for vertical recess for 3D device integration | Jeffrey Smith, Daniel Chanemougame, Lars Liebmann, Paul Gutwin, Subhadeep Kal +1 more | 2025-06-17 |
| 12284820 | Dual metal wrap-around contacts for semiconductor devices | Hiroaki Niimi, Takahiro Hakamata | 2025-04-22 |