Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419063 | Inductor on microelectronic die | — | 2025-09-16 |
| 12400945 | Electronic device multilevel package substrate for improved electromigration performance | Sylvester Ankamah-Kusi, Yiqi Tang, Rajen Manicon Murugan | 2025-08-26 |
| 12389730 | Integrated circuit device package | Grimmett Dale Jacky | 2025-08-12 |
| 12347738 | Sensor package cavities with polymer films | Leslie Edward Stark | 2025-07-01 |
| 12300678 | Package for power semiconductor devices | Steven R. Tom, Paul Brohlin | 2025-05-13 |
| 12299364 | Multi-algorithmic approach to represent highly non-linear high dimensional space | Nikhil Gupta, Timothy W. Fischer, Ashish Khandelwal | 2025-05-13 |
| 12230594 | Printed package and method of making the same | — | 2025-02-18 |
| 12203776 | Miniature sensor cavities | Christopher Daniel Manack, Leslie Edward Stark | 2025-01-21 |
| 12198995 | Covers for semiconductor package components | Leslie Edward Stark | 2025-01-14 |
| 12191273 | Pre-molded leadframes in semiconductor devices | — | 2025-01-07 |