Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12319563 | Semiconductor package with metal column mold barrier | James Raymond Maliclic Baello | 2025-06-03 |
| 12288763 | Flip chip package assembly having post connects with solder-based joints | — | 2025-04-29 |
| 12266624 | Semiconductor die with solder restraining wall | John Carlo Cruz Molina | 2025-04-01 |
| 12266631 | Flip-chip package assembly | John Carlo Cruz Molina, Steffany Ann Lacierda Moreno | 2025-04-01 |
| 12205871 | Conductive member cavities | Jovenic Romero Esquejo, Arvin Cedric Quiambao Mallari | 2025-01-21 |