Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261141 | IC device with chip to package interconnects from a copper metal interconnect level | — | 2025-03-25 |
| 12189940 | Fingerprint encoded gesture initiation of device actions | Amit Kumar Agrawal, Varun Shrivastava | 2025-01-07 |