Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394671 | Efficient removal of street test devices during wafer dicing | Michael Todd Wyant, Christopher Daniel Manack | 2025-08-19 |
| 12255097 | Splash resistant laser wafer singulation by crack length control | Yang Liu, Hao Zhang, Venkataramanan Kalyanaraman, Qing Ran, Yuan Zhang +2 more | 2025-03-18 |