Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293948 | Flip chip semiconductor device package with mold compound seal | Amit Sureshkumar Nangia | 2025-05-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293948 | Flip chip semiconductor device package with mold compound seal | Amit Sureshkumar Nangia | 2025-05-06 |