Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283559 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Xiao Lin Kang | 2025-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283559 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Xiao Lin Kang | 2025-04-22 |