Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237247 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2025-02-25 |
| 12187601 | Electronic sensors with sensor die in package structure cavity | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2025-01-07 |