Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240751 | Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method | Kazutoshi TSUYUTANI | 2025-03-04 |
| 12243841 | Electronic component embedded substrate and circuit module using the same | Toshiyuki Abe, Hironori Chiba, Tetsuya Yazaki, Hiroshige Ohkawa | 2025-03-04 |
| 12186758 | Automated analysis device | Akihiro Yasui, Akihisa Makino, Masashi Akutsu, Hiroyuki Mishima | 2025-01-07 |