Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191226 | Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor device | Ming-Tzong Yang, Hsien-Hsin Lin, Chia-Che CHUNG, Chee-Wee Liu | 2025-01-07 |