Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317517 | Semiconductor die package and methods of formation | Hsin-Li Cheng, Yingkit Felix Tsui | 2025-05-27 |
| 12230542 | Method for dicing a semiconductor wafer structure | — | 2025-02-18 |
| 12199139 | Trench capacitor film scheme to reduce substrate warpage | Ting-Chen Hsu, Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shi-Min Wu | 2025-01-14 |