Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381081 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, U-Ting Chiu, Chun-Neng Lin +2 more | 2025-08-05 |
| 12272598 | Conductive feature of a semiconductor device | U-Ting Chiu, Yu-Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh | 2025-04-08 |
| 12224204 | Semiconductor device and method | Yu-Shih Wang, Ming-Hsi Yeh | 2025-02-11 |