Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374600 | Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same | Wei-Teng Chang, Chih-Kung Huang, Hui Yu | 2025-07-29 |