Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417973 | Semiconductor packaging structure and method for manufacturing the same | Chen-Te Chu, Yuan-Yang Hsiao, Chih-Pin Chiu, Ying-Yao Lai, Chen-Chiu Huang +1 more | 2025-09-16 |
| 12406952 | Chip structure with conductive layer | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2025-09-02 |
| 12368094 | Semiconductor structures and methods of forming the same | Yuan-Yang Hsiao, Chen-Chiu Huang, Dian-Hau Chen | 2025-07-22 |
| 12186847 | Selective field-assisted machining system | Jianfeng Xu, Zhengding Zheng, Jianguo Zhang, Kai-Feng Huang, Xiao Ling Chen +1 more | 2025-01-07 |