Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389672 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2025-08-12 |
| 12322715 | Method of forming integrated chip structure having slotted bond pad in stacked wafer structure | Harry-Hak-Lay Chuang, Wei-Cheng Wu | 2025-06-03 |
| 12255133 | Electrical fuse (e-fuse) one-time programmable (OTP) device and manufacturing method thereof | Alexander Kalnitsky, Wei-Cheng Wu, Harry-Hak-Lay Chuang, Chia-Wen Liang | 2025-03-18 |