Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382734 | Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same | Feng-Chien Hsieh, Chia-Yen Hsu, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee | 2025-08-05 |
| 12324254 | Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same | Feng-Chien Hsieh, Chia-Yen Hsu, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee | 2025-06-03 |
| 12300664 | Edge-trimming methods for wafer bonding and dicing | Feng-Chien Hsieh, Yun-Wei Cheng, Mu-Han Cheng, Kuo-Cheng Lee | 2025-05-13 |
| 12302637 | Semiconductor wafer with devices having different top layer thicknesses | Gulbagh Singh, Kuan-Liang Liu, Wang Po-Jen, Kun-Tsang Chuang | 2025-05-13 |
| 12243898 | Image sensor with high quantum efficiency | Feng-Chien Hsieh, Kuo-Cheng Lee, Yun-Wei Cheng | 2025-03-04 |
| 12218173 | Image sensor device | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsun-Ying Huang | 2025-02-04 |
| 12211869 | Optical blocking structures for black level correction pixels in an image sensor | Feng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee | 2025-01-28 |
| 12191327 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang, Yen-Liang Lin +1 more | 2025-01-07 |