Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230603 | Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer | Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Yu Lee | 2025-02-18 |