HK

Huijae Kim

Samsung: 1 patents #6,142 of 15,164Top 45%
📍 Jeju, WA: #1 of 1 inventorsTop 100%
Overall (2025): #364,564 of 469,880Top 80%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12424585 Apparatus for bonding chip band and method for bonding chip using the same Euisun Choi, Mingu LEE, Hyeonggyun Cheong, Yunpyo Hong 2025-09-23