Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406966 | Device with embedded high-bandwidth, high-capacity memory using wafer bonding | Khandker N. Quader, Robert Norman, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan +3 more | 2025-09-02 |
| 12265961 | Systems and methods for sending and receiving math-based currency via a fiat currency account | Michael D. Dowling, Jesse K. Lund | 2025-04-01 |