Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359097 | Low bond-temperature hot melt adhesive with high impact strength and chemical resistance | Paul Kurtz, Bo Sun, Ewelina Szymczak, Jerome Moyer, Saeid Savarmand | 2025-07-15 |
| 12275860 | Digitally printed labels | Yongping Zha, Robert Mateuszczyk, Jing Jiang, Joanne Guite, Nissra Kousar | 2025-04-15 |