Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424521 | Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laser | Michele DERAI | 2025-09-23 |
| 12211763 | Enhanced thermal dissipation in flip-chip semiconductor devices using laser direct structuring (LDS) technology | Michele DERAI | 2025-01-28 |