Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381141 | Semiconductor device and method of forming hybrid substrate with uniform thickness | Linda Pei Ee Chua, Jian Zuo, Hin Hwa Goh | 2025-08-05 |
| 12319564 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2025-06-03 |
| 12300590 | Package structure and method for forming same | — | 2025-05-13 |
| 12249582 | SIP package structure | Xueqing Chen, SHASHA ZHOU, Jian-Hong Chen, Shuo Liu, Danfeng Yang | 2025-03-11 |