Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211778 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2025-01-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211778 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2025-01-28 |