Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334470 | Chip packaging structure and related inner lead bonding method | Po-Chi Chen, Kuo-Wei Tseng | 2025-06-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334470 | Chip packaging structure and related inner lead bonding method | Po-Chi Chen, Kuo-Wei Tseng | 2025-06-17 |