Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381074 | Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer | Christof Weber, Stefan WELSCH | 2025-08-05 |
| 12325081 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Carl Frintert, Peter Wiesner | 2025-06-10 |
| 12311455 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Patrick Berger, Wolfgang Dietz, Carl Frintert, Matthias Guenther | 2025-05-27 |