Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356700 | Method for splitting semiconductor wafers | Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2025-07-08 |
| 12211702 | Solid body and multi-component arrangement | Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter | 2025-01-28 |