Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368081 | Electronic package comprising conductive layer connected electrode pad through electronic component | Ho-Chuan Lin, Chia-Chu Lai | 2025-07-22 |
| 12334425 | Electronic package and manufacturing method thereof | Ho-Chuan Lin, Chia-Chu Lai | 2025-06-17 |
| 12293952 | Electronic package and manufacturing method thereof | Ho-Chuan Lin, Chia-Chu Lai | 2025-05-06 |