Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278173 | Electronic package and substrate structure thereof | Wen-Chen Hsieh, Ya-Ting Chi, Chia-Wen Tsao, Yi-Lin Tsai, Hsiu-Fang Chien | 2025-04-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278173 | Electronic package and substrate structure thereof | Wen-Chen Hsieh, Ya-Ting Chi, Chia-Wen Tsao, Yi-Lin Tsai, Hsiu-Fang Chien | 2025-04-15 |